Immersion photolithography system and method using microchannel nozzles

ABSTRACT

A liquid immersion photolithography system includes an exposure system that exposes a substrate with electromagnetic radiation and includes a projection optical system that focuses the electromagnetic radiation on the substrate. A liquid supply system provides liquid flow between the projection optical system and the substrate. An optional plurality of micronozzles are arranged around the periphery of one side of the projection optical system so as to provide a substantially uniform velocity distribution of the liquid flow in an area where the substrate is being exposed.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to liquid immersion photolithography, andmore particularly, to a method and a system for controlling velocityprofile of liquid flow in an immersion photolithographic system.

2. Description of the Related Art

The practical limits of optical lithography assume that the mediumthrough which imaging is occurring is air. This practical limit isdefined by the effective wavelength equation${\Lambda_{eff} = \frac{\lambda}{2 \cdot n \cdot {NA}}},$where λ is the wavelength of incident light, NA is the numericalaperture of the projection optical system, and n is the index ofrefraction of the medium. Now, by introducing a liquid (instead of theair) between a last lens element of the projection optical system and awafer being imaged, the refractive index changes (increases), therebyenabling enhanced resolution by lowering the effective wavelength of thelight source. Lowering a light source's wavelength automatically enablesfiner resolution of smaller details. In this way, immersion lithographybecomes attractive by, for instance, effectively lowering a 157 nm lightsource to a 115 nm wavelength, thereby gaining resolution while enablingthe printing of critical layers with the same photolithographic toolsthat the industry is accustomed to using today.

Similarly, immersion lithography can push 193 nm lithography down to 145nm. In theory, older technology such as the 193 nm tools can now stillbe used. Also, in theory, many difficulties of 157 nm lithography—largeamounts of CaF₂, hard pellicles, a nitrogen purge, etc.—can be avoided.

However, despite the promise of immersion photolithography, a number ofproblems remain, which have so far precluded commercialization ofimmersion photolithographic systems. These problems include opticaldistortions. For example, during immersion lithography scanning,sufficient g-loads are created that can interfere with systemperformance. These accelerative loads can cause a vibrational, fluidicshearing interaction with the lens resulting in optical degradation. Theup and down scanning motions within the lens-fluid environment ofImmersion Lithography can generate varying fluidic shear forces on theoptics. This can cause lens vibrational instability, which may lead tooptical “fading”. Other velocity profile non-uniformities can also causeoptical distortions.

SUMMARY OF THE INVENTION

The present invention is directed to an immersion photolithographysystem with a near-uniform velocity profile of the liquid in theexposure area that substantially obviates one or more of the problemsand disadvantages of the related art.

There is provided a liquid immersion photolithography system includingan exposure system that exposes a substrate with electromagneticradiation, and includes a projection optical system that focuses theelectromagnetic radiation on the substrate. A liquid supply systemprovides liquid flow between the projection optical system and thesubstrate. A plurality of micronozzles are optionally arranged aroundthe periphery of one side of the projection optical system so as toprovide a substantially uniform velocity distribution of the liquid flowin an area where the substrate is being exposed.

In another aspect there is provided a liquid immersion photolithographysystem including an exposure system that exposes an exposure area on asubstrate with electromagnetic radiation and includes a projectionoptical system. A liquid flow is generated between the projectionoptical system and the exposure area. A microshower is at one side ofthe projection optical system, and provides the liquid flow in theexposure area having a desired velocity profile.

Additional features and advantages of the invention will be set forth inthe description that follows. Yet further features and advantages willbe apparent to a person skilled in the art based on the description setforth herein or may be learned by practice of the invention. Theadvantages of the invention will be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGS.

The accompanying drawings, which are included to provide a furtherunderstanding of the exemplary embodiments of the invention and areincorporated in and constitute a part of this specification, illustrateembodiments of the invention and together with the description serve toexplain the principles of the invention. In the drawings:

FIG. 1 shows a side view of a basic liquid immersion photolithographysetup.

FIG. 2 shows a plan view of the setup of FIG. 1.

FIG. 3 shows the basic liquid immersion photolithography setup withliquid flow direction reversed, compared to FIG. 1.

FIG. 4 shows additional detail of the liquid immersion photolithographysystem.

FIG. 5 shows a partial isometric view of the structure of FIG. 4.

FIG. 6 shows an exemplary liquid velocity profile.

DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made in detail to the embodiments of the presentinvention, examples of which are illustrated in the accompanyingdrawings.

One major problem in immersion photolithography is the non-uniformity ofthe liquid flow, particularly its gradient in the vertical direction.The non-uniformity is due primarily to the fact that near a movingsurface, the liquid is in contact with that surface (e.g., a surface ofa wafer). For example, during scanning, the wafer moves relative to theexposure system, creating a “dragging effect” near its surface. Thus,the laws of fluid dynamics dictate that the fluid velocity relative tothe wafer surface is zero in those areas (or at least close to zero),while fluid velocity is maximum further away from the wafer surface.Similarly, the fluid velocity relative to the bottom surface of the lensis zero. These fluid velocity variations are known as “boundary layer”velocity profiles. The combination of these effects produces a shearingforce in the liquid that creates a twofold optical distortionproblem: 1) the generation of inertial vibrational forces upon theaperture hardware (resulting in optical distortion), and 2) theformation of velocity striations within the fluid, which causeadditional optical distortions.

Additionally, injection of liquid into the exposure area also provides aliquid flow with potential additional non-uniformities in the velocitydistribution. For example, a number of striations can exist within thefluid, further degrading exposure quality. Similarly, air bubbles,opto-fluidic vibrations, or turbulence in the liquid flow also candegrade the overall performance of the photolithographic system becauseof the introduction of optical distortions into the exposure process.Thus, dealing with velocity profile non-uniformities is important fromthe perspective of the quality of imaging in a photolithographic system.In the ideal case, the velocity profile of the liquid is substantiallyuniform everywhere.

FIG. 1 illustrates a liquid immersion photolithographic system of thepresent invention in a block diagram form. As shown in FIG. 1, aprojection optical system 100 of a photolithographic tool includes alens 102 (which is typically comprised of multiple lens elements). Inthis figure, the lens 102 has a flat bottom surface 108, although thatneed not be the case. Lens height 409 (see FIG. 4) may be adjustable tomaintain a specific distance to the wafer 101.

The projection optical system 100 also includes a housing 103 (only thelower portion is shown). The housing 103 includes an annular liquidchannel 105A, and optionally a plurality of other such channels 105B,etc. Liquid flows through the channels 105 (flowing in through thechannel 105A in this figure, and flowing out through the channel 105B).The arrows 107A, 107B designate the direction of liquid flow over awafer 101, as the wafer 101 is being scanned across a field of view ofthe projection optical system 100.

FIG. 2 illustrates a bottom-up view of the structure shown in FIG. 1. Asshown in FIG. 2, a clear aperture area 216 defines an exposure area ofthe projection optical system 100 and the lens 102. The various arrows107A-107D, 211A-211D illustrate possible liquid flow directions at anygiven time. As may be further seen in FIG. 2, the housing 103 alsoincludes a number of pressurized chambers 215A-215D. Each pressurizedchamber 215 may also be referred to as a “plenum.” The plenum 215therefore acts as a pressure source, as discussed below. It will also beappreciated that the liquid flow can be turned off completely when noexposure is taking place, or when the wafer 101 is being swapped.

Further, as shown in FIG. 2, the lower portion of the housing 103 may bedivided into a number of sections. In this figure, there are four suchsections (quadrants), separated by gaps 217A-217D. It will beappreciated that the number of such sections may be more or fewer thanfour, although, in most applications, it is expected that four quadrantsis an optimal number. For example, for motion only along one axis,dividing the housing 103 into two sections may be sufficient. For X-Ymotion, four sections (quadrants) are preferred. For even greatercontrol, eight sections may be needed. This sectioning permits controlover liquid flow direction, as also discussed further below. Controllingthe direction of liquid flow makes it possible to counteract mechanicalstrains on the lens 102, therefore the flow profile in the X direction(especially during a step) may be different from the flow profile in theY direction (especially during a scan).

FIG. 3 illustrates the same structure as in FIG. 1, except that thedirection of the liquid flow is reversed. As will be appreciated by oneof ordinary skill in the art, the ability to reverse the direction ofliquid flow is important in a practical photolithographic system, sincethe direction of wafer motion is normally not limited to just onedirection. Similarly, it will be appreciated by one of ordinary skill inthe art that, as in FIG. 2, the wafer 101 can move both in the Xdirection and the Y direction. Thus, dividing the housing 103 intoquadrants permits the direction of liquid flow to be adjusted for anydirection of wafer movement.

FIG. 4 illustrates an embodiment of the present invention in additionaldetail. As shown in FIG. 4, the lens 102 is mounted in the housing 103.The housing 103 has the annular channels 105A, 105B, through whichliquid flows in and out from a liquid supply system (not shown in thesefigures). From the channel 105A, the liquid then enters a first largeplenum 215A. It then flows through a diffuser screen 412A, into a firstsmall plenum 414A (which is typically smaller than the first plenum215A). The diffuser screen 412A helps remove the turbulence and airbubbles that may be present in the first large plenum 215A. The diffuserscreen 412 also acts as a pressure drop screen.

The first small plenum 414A also acts as a pressure chamber. From thefirst small plenum 414A, the liquid then flows through a plurality ofmicrochannel nozzles (micronozzles) 416A, arranged in a form of amicroshower. Thus, by the time the liquid reaches the micronozzles 416,the pressure at the entry to all the micronozzles 416 is uniform, andturbulence and gas bubbles have been substantially removed from theliquid. After the micronozzles 416, the liquid flows into the clearaperture area 216 under the lens 102, such that the space between thelens 102 and the wafer 101 is filled with the liquid.

In the clear aperture area 216, the liquid flow is uniform with height,and free of turbulence, bubbles, striations and other imperfections thataffect optical image quality.

On the other side of the clear aperture area 216, the liquid once againflows through a set of microchannel nozzles 416B, into a second smallplenum 414B, through a diffuser screen 412B, into a second large plenum215B and out through the channel 105B.

Thus, with the relative motion of the wafer 101 from left to right inFIG. 4, the wafer 101 creates a “dragging effect” on the liquid. Thedirection of the liquid flow therefore needs to be from right to left,to counteract the “dragging effect,” and result in substantially uniformvelocity profile.

In FIG. 4, 420 designates effective fluid velocity profile within theclear aperture area 216 as induced by wafer 101 motion. 421 designatescounter-injected fluid velocity profile from the microchannel nozzles416, yielding near net-zero resultant fluid velocity at the interfacebetween the lens 102 and the liquid in clear aperture area 216.

The microchannel nozzles 416 also refresh (i.e., replace) the workingliquid from time to time (which may be necessary to prevent itsdisassociation over time, since exposure to intense electromagneticradiation may break down the molecules of the liquid), so as to precludethermal gradients from causing refractive distortions and image qualitydegradation. Avoiding dissociation of liquid (for example water) due toconstant flow is another advantage. At the short exposure wavelength,water can dissociate at approximately 2.86 J/cm² RT and normal P turnsto 4.75*10⁻¹⁹ J per molecule. At 193 nm with one photon carries1.03*10⁻¹⁸ J. Additionally, keeping the liquid refreshed allows tomaintain a constant temperature of the liquid. The liquid may berefreshed during exposure, or between exposures.

The micronozzles 416 also act as a buffer against inertial shearingforces between the optics and the liquid. Note that the shearing forceis defined by the equation${F = {A \cdot \mu \cdot \frac{\mathbb{d}v}{\mathbb{d}x}}},$wherein A is the area, μ is a viscosity parameter, x is a distancevariable, and v is the velocity. The shearing force is approximately 1Newton in the case of a typical 100 micron gap between the wafer 101 andthe lens 102. Neutralizing these shearing forces is accomplished byinertially dampening the relative accelerative motion between the lens102 and fluid. This is accomplished by simply creating fluidic motion ina direction opposite to scanning. The microchannel nozzles 416 also actas a buffer against inertial shearing forces between the optics andfluid.

Additionally, the housing 103 includes a system for supplying gas toremove any excess liquid from the wafer 101. The housing 103 includes asupply side annulus 406A for gas inflow from a gas supply system (notshown in FIG. 4), a gas seal 410A, which bridges the distance to thewafer 101 and makes a “squeegee” so as to contain and remove any excessliquid, and a return side gas outflow annulus 405A (through which excessliquid is removed). The excess liquid may be removed through the returnside gas outflow annulus 405A, together with the exhausted gas. Asimilar structure may be found in an opposite quadrant of the housing103, as shown on the left side of FIG. 4. The gas supply system works inconjunction with the liquid supply system, whenever there is liquid flowpresent, and, consequently, need only be turned on when there is liquidflow in the clear aperture area 216.

As noted above, in FIG. 4, with the wafer movement from left to right,the liquid flow is “in” at channel 105A, and “out” at channel 105B. Whenthe scan direction is reversed, the liquid flow reverses as well.

FIG. 5 shows a partial isometric view of the micronozzle structure areaof FIG. 4. The channels 105A-105D (not shown in FIG. 5) are connected toouter tubes 507A-507D, through which liquid is supplied. Similarly,though not shown in this figure, the annuli 405, 406 may be connected totubular gas couplings.

FIG. 6 illustrates an example of a liquid exhaust velocity profile thatmay be used in the present invention. As will be appreciated by one ofordinary skill in the art, a “natural” velocity profile is not uniformwith height in FIG. 4, but rather may have a vertical gradient, whichcan cause optical distortion. To compensate for this natural gradient,different lengths of tubes (micronozzles 416) may be used, as shown inFIG. 6. In FIG. 6, the micronozzle length ranges from a maximum of L₁ toa minimum of L₂, resulting in approximately the velocity profile at theexit of the micronozzles 416 shown on the left of FIG. 6. The longer themicronozzle 416, the lower the output velocity of the liquid from thatparticular micronozzle. Furthermore, the micronozzles 416 themselves mayhave different diameters, if needed to further control the velocityprofile. Note further that the tubes of the micronozzles 416 need notnecessarily be parallel to the wafer 101, to further control thevelocity profile.

The height of the liquid above the wafer 101, in a typical system, isapproximately 100 microns. Greater height generally results in a needfor more micronozzles in 416A due to a larger volume in which velocityprofile needs to be controlled.

Thus, with careful selection of the lengths, diameters and orientationsof the micronozzles 416, the velocity profile in the clear aperture area216 of the wafer 101 may be controlled, resulting in a substantiallyuniform velocity profile throughout the clear aperture area 216, therebyimproving exposure quality. In essence, the velocity profile generatedby a structure such as shown in FIG. 6 may be “opposite” of the“natural” profile that would exist otherwise. Thus, the characteristicsof the micronozzles 416 are tailored to result in a substantiallyuniform velocity profile.

During scanning, the wafer 101 moves in one direction, while the liquidis recirculated and injected in the opposite direction. The effect ofthe present invention is therefore to neutralize the liquid velocityprofile induced by the scanning motion, causing inertial dampeningbetween the lens 102 and the liquid. In other words, the net effect is a“zero” net inertia and velocity profile steering away from motion.Depending on the direction of the liquid flow, either a reduction orelimination of shear forces, or a reduction in optical distortions mayresult. Thus, the immersion lithographic process is capable ofperforming at peak levels due to constant fluid refresh, avoidance ofgas bubbles, and the buffering of opto-fluidic vibrations.

Note further that while the liquid in the plenum 215 may have turbulenceand gas bubbles, by the time it travels through the diffuser screen 412,the flow is uniform. Therefore, after passing through the diffuserscreen 412, the plenum 414, and exiting from the micronozzles 416, theliquid flow has a desired velocity profile, substantially withoutimperfections caused by striations, opto-fluidic vibrations, turbulence,gas bubbles, and other non-uniformities, resulting in improved imagequality.

As noted above, the bottom surface 108 of the lens 102 need not be flat.It is possible to use a lens 102 with a curved bottom surface 108, andcompensate for any induced velocity profile non-uniformities with anappropriate arrangement of micronozzle lengths, diameters, andorientations, to result in a near-uniform velocity profile.

The micronozzles 416 may be constructed using conventional lithographictechniques on silicon material. On a microscopic scale, the micronozzles416 resemble a honeycomb material composed of tubes that are stacked ina staggered formation that exhibits key characteristic dimensions ofhydraulic diameter and length. The micronozzles 416 may be flared outinto the clear aperture area 216.

Typical tubular diameters of the micronozzles 416 may vary, for example,from a few microns to tens of microns (e.g., 5-50 microns), and in somecases, up to 5 mm in diameter, and lengths of between about 10 to 100diameters. Other lengths and/or diameters may be used. Slits, ratherthan round nozzles, may also be used. The number of micronozzles perunit area may also be varied.

For 193 nanometer imaging, the liquid is preferably water (e.g.,de-ionized water), although other liquids, for example, cycle-octane,Krypton® (Fomblin oil) and perfluoropolyether oil, may be used.

The present invention results in a number of benefits to a liquidimmersion photolithographic system. For example, in a step and scansystem, transmission is improved, and there is less distortion. Dustparticles in the air cannot enter the clear aperture area 216 betweenthe lens 102 and the wafer 101, since the liquid itself does not containany dust, and the presence of the liquid acts as a barrier to the dustbeing present in the clear aperture area 216 during exposure.Preferably, the liquid is brought in after the wafer 101 has been loadedonto a wafer stage, and removed before the wafer 101 is unloaded. Thisminimizes dust and particulate contamination. Additionally, other waysof keeping the liquid from spilling during wafer exchange are possibleas well, and the present invention is not limited to just the approachdescribed above.

The fluid velocity profile induced by the scanning motion isneutralized, causing inertial dampening between lens 102 and theshearing fluid. Aside from acting as inertial dampers, the micronozzles416 serve to refresh the working fluid volume, thereby eliminatingrefractive distortions due to thermal gradients created by the lightsource. A side benefit of the micronozzles 416 is their ability todiscourage the formation of gas-bubbles during volume refresh. Also, thesize of these micronozzles 416 prevents the formation of gas-bubblesthat plague more conventional refresh techniques. All of these benefitsallow the use of generally existing photolithographic tools andwavelengths to define much smaller features on a semiconductor surface.

CONCLUSION

While various embodiments of the present invention have been describedabove, it should be understood that they have been presented by way ofexample, and not limitation. It will be apparent to persons skilled inthe relevant art that various changes in form and detail can be madetherein without departing from the spirit and scope of the invention.

The present invention has been described above with the aid offunctional building blocks and method steps illustrating the performanceof specified functions and relationships thereof. The boundaries ofthese functional building blocks and method steps have been arbitrarilydefined herein for the convenience of the description. Alternateboundaries can be defined so long as the specified functions andrelationships thereof are appropriately performed. Also, the order ofmethod steps may be rearranged. Any such alternate boundaries are thuswithin the scope and spirit of the claimed invention. One skilled in theart will recognize that these functional building blocks can beimplemented by discrete components, application specific integratedcircuits, processors executing appropriate software and the like or anycombination thereof. Thus, the breadth and scope of the presentinvention should not be limited by any of the above-described exemplaryembodiments, but should be defined only in accordance with the followingclaims and their equivalents.

1. A liquid immersion photolithography system comprising: an exposuresystem that exposes a substrate with electromagnetic radiation andincludes a projection optical system that focuses the electromagneticradiation on the substrate; a liquid supply system that provides liquidflow between the projection optical system and the substrate; and aplurality of micronozzles arranged around a periphery of the projectionoptical system so as to provide a substantially uniform velocitydistribution of the liquid flow between the substrate and the projectionoptical system.
 2. The liquid immersion photolithography system of claim1, wherein the plurality of micronozzles include a plurality of tubes ofvarying lengths.
 3. The liquid immersion photolithography system ofclaim 1, wherein the varying lengths of the tubes provide a velocityprofile that compensates for non-uniformities.
 4. The liquid immersionphotolithography system of claim 1, wherein the liquid supply systemincludes: an input channel for delivering the liquid into a firstplenum; a first diffuser screen through which the liquid can flow into asecond plenum, wherein the liquid can then flow into the micronozzles.5. The liquid immersion photolithography system of claim 4, wherein theliquid supply system further comprises: a second plurality ofmicronozzles removing the liquid from the exposure area into a thirdplenum; a second diffuser screen through which the liquid flows into afourth plenum; and an output channel through which the liquid iscirculated.
 6. The liquid immersion photolithography system of claim 1,wherein the projection optical system includes a housing with a gas sealbetween the housing and the substrate.
 7. The liquid immersionphotolithography system of claim 6, wherein the housing includes aplurality of annular channels connected to the gas seal through whichnegative pressure is maintained around the exposure area so as to removestray liquid.
 8. The liquid immersion photolithography system of claim1, wherein the micronozzles are between 5 microns and 5 millimeters indiameter.
 9. The liquid immersion photolithography system of claim 1,wherein the micronozzles are slit-shaped.
 10. The liquid immersionphotolithography system of claim 1, wherein at least some of themicronozzles include a portion that flares out into an area between thesubstrate and the projection optical system.
 11. The liquid immersionphotolithography system of claim 1, wherein a direction of the liquidflow is reversible.
 12. The liquid immersion photolithography system ofclaim 1, wherein the liquid supply system includes at least threechannels through which liquid can flow.
 13. The liquid immersionphotolithography system of claim 1, wherein the liquid supply systemcompensates for non-uniformities in a velocity profile.
 14. A liquidimmersion photolithography system comprising: an exposure system thatexposes an exposure area on a substrate with electromagnetic radiationand includes a projection optical system; means for providing a liquidflow between the projection optical system and the exposure area; and afirst microshower at one side of the projection optical system thatprovides the liquid flow having a desired velocity profile when theliquid flow is present in the exposure area.
 15. The liquid immersionphotolithography system of claim 14, wherein the microshower includes aplurality of tubes of varying lengths.
 16. The liquid immersionphotolithography system of claim 15, wherein the varying lengths of thetubes provide a velocity profile that compensates for non-uniformities.17. The liquid immersion photolithography system of claim 14, furthercomprising a liquid supply system that includes: an input channel fordelivering the liquid into a first plenum; a first diffuser screenthrough which the liquid can flow into a second plenum, wherein theliquid flows into the exposure area through the microshower.
 18. Theliquid immersion photolithography system of claim 15, wherein the liquidsupply system further comprises: a second microshower for removing theliquid from the exposure area into a third plenum; a second diffuserscreen through which the liquid can flow into a fourth plenum; and anoutput channel through which the liquid can circulate out of theexposure area.
 19. The liquid immersion photolithography system of claim14, wherein the projection optical system includes a housing with a gasseal between the housing and the substrate.
 20. The liquid immersionphotolithography system of claim 19, wherein the housing includes aplurality of channels through which negative pressure is maintainedaround the exposure area so as to remove stray liquid.
 21. The liquidimmersion photolithography system of claim 14, wherein the microshowerhas micronozzles that are between 5 microns and 5 millimeters indiameter.
 22. The liquid immersion photolithography system of claim 21,wherein at least some of the micronozzles include a portion that flaresout into the exposure area.
 23. The liquid immersion photolithographysystem of claim 21, wherein the micronozzles are slit-shaped.
 24. Theliquid immersion photolithography system of claim 14, wherein adirection of the liquid flow is reversible.
 25. The liquid immersionphotolithography system of claim 17, wherein the liquid supply systemincludes at least three channels through which liquid can flow.
 26. Theliquid immersion photolithography system of claim 14, wherein themicroshower compensates for non-uniformities in the velocity profile dueto scanning.
 27. A liquid immersion photolithography system comprising:an exposure system that exposes an exposure area on a substrate withelectromagnetic radiation and includes a projection optical system; aliquid flow between the projection optical system and the exposure areahaving a velocity profile that compensates for relative motion of theexposure system and the substrate.
 28. A liquid immersionphotolithography system comprising: an exposure system that exposes anexposure area on a substrate with electromagnetic radiation and includesa projection optical system; and a plurality of micronozzles around aperiphery of a lens of the projection optical system that provide aliquid flow in the exposure area.
 29. A liquid immersionphotolithography system comprising: an exposure system that exposes asubstrate with electromagnetic radiation and includes a projectionoptical system that focuses the electromagnetic radiation on thesubstrate; and a liquid supply system that provides liquid flow betweenthe projection optical system and the substrate, wherein a direction ofthe liquid flow may be changed so as to compensate for direction ofmovement of the substrate.
 30. The liquid immersion photolithographysystem of claim 29, further including a plurality of micronozzlesarranged around a periphery of the projection optical system so as toprovide a substantially uniform velocity distribution of the liquid flowbetween the substrate and the projection optical system.
 31. The liquidimmersion photolithography system of claim 30, wherein the plurality ofmicronozzles include a plurality of tubes of varying lengths.
 32. Theliquid immersion photolithography system of claim 31, wherein thevarying lengths of the tubes provide a velocity profile that compensatesfor non-uniformities.
 33. The liquid immersion photolithography systemof claim 29, wherein the liquid supply system includes: an input channelfor delivering the liquid into a first plenum; a first diffuser screenthrough which the liquid can flow into a second plenum, wherein theliquid can then flow into the micronozzles.
 34. The liquid immersionphotolithography system of claim 33, wherein the liquid supply systemfurther comprises: a second plurality of micronozzles removing theliquid from the exposure area into a third plenum; a second diffuserscreen through which the liquid flows into a fourth plenum; and anoutput channel through which the liquid is circulated.
 35. The liquidimmersion photolithography system of claim 29, wherein the liquid supplysystem compensates for non-uniformities in a velocity profile.
 36. Amethod of exposing a substrate comprising: projecting electromagneticradiation onto the substrate using a projection optical system;delivering a liquid flow between the projection optical system and thesubstrate; and controlling a velocity profile of the liquid flow to asto provide a substantially uniform velocity profile.
 37. The method ofclaim 36, further comprising the step of removing excess liquid from thesubstrate using a gas supply system.
 38. The method of claim 36, furthercomprising the step of reversing direction of the liquid flow.
 39. Amethod of exposing a substrate comprising: projecting electromagneticradiation onto the substrate using a projection optical system;delivering a liquid flow between the projection optical system and thesubstrate; and changing a direction of the liquid flow so as tocompensate for a change in a direction of movement of the substrate. 40.The method of claim 39, further comprising the step of removing excessliquid from the substrate using a gas supply system.